| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family |
Intel Xeon E3-1200 v6
|
| Model number |
E3-1225 v6
|
| Frequency | 3300 MHz |
| Turbo frequency | 3700 MHz |
| Bus speed | 8 GT/s DMI |
| Clock multiplier | 33 |
| Package | 1151-land Flip-Chip Land Grid Array |
| Socket | Socket 1151 / H4 / LGA1151 |
| Size | 1.48" x 1.48" / 3.75cm x 3.75cm |
| Introduction date | March 28, 2017 |
| Architecture / Microarchitecture | |
| Microarchitecture | Kaby Lake |
| Processor core | Kaby Lake-S |
| Core stepping | B0 (SR32C) |
| Manufacturing process | 0.014 micron |
| Data width | 64 bit |
| The number of CPU cores | 4 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 4 x 32 KB 8-way set associative instruction caches 4 x 32 KB 8-way set associative data caches |
| Level 2 cache size | 4 x 256 KB 4-way set associative caches |
| Level 3 cache size | 8 MB 16-way set associative shared cache |
| Physical memory | 64 GB |
| Multiprocessing | Uniprocessor |
| Features |
|
| Low power features | Enhanced SpeedStep technology |
| Integrated peripherals / components | |
| Display controller | 3 displays |
| Integrated graphics | GPU Type: Intel HD P630 Graphics tier: GT2 Microarchitecture: Gen 9 LP Base frequency (MHz): 350 Maximum frequency (MHz): 1150 |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1866, DDR4-2400 Maximum memory bandwidth (GB/s): 37.5 ECC supported: Yes |
| Other peripherals |
|
| Electrical / Thermal parameters | |
| V core | 0.55V - 1.52V |
| Thermal Design Power | 73 Watt |

















