General information |
Type |
CPU / Microprocessor |
Market segment |
Server |
Family |
Intel Xeon Gold
|
Model number |
5115
|
Frequency |
2400 MHz |
Turbo frequency |
3200 MHz |
Bus speed |
10.4 GT/s UPI |
Clock multiplier |
24 |
Package |
3647-land Flip-Chip Land Grid Array (FC-LGA) |
Socket |
Socket 3647 / P0 / LGA3647-0 |
Size |
2.99" x 2.22" / 7.6cm x 5.65cm |
Fan/heatsink |
1U form factor |
Introduction date |
July 11, 2017 |
Architecture / Microarchitecture |
Microarchitecture |
Skylake |
Platform |
Purley |
Processor core |
Skylake-SP |
Core stepping |
M0 (SR3GB) |
Manufacturing process |
0.014 micron |
Die |
HCC type |
Data width |
64 bit |
The number of CPU cores |
10 |
The number of threads |
20 |
Floating Point Unit |
Integrated |
Level 1 cache size |
10 x 32 KB instruction caches
10 x 32 KB data caches |
Level 2 cache size |
10 x 1 MB caches |
Level 3 cache size |
13.75 MB non-inclusive shared cache |
Physical memory |
768 GB |
Multiprocessing |
Up to 4 processors |
Features |
- MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
- AES / Advanced Encryption Standard instructions
- AVX / Advanced Vector Extensions
- AVX2 / Advanced Vector Extensions 2.0
- AVX-512 / Advanced Vector Extensions 512
- BMI / BMI1 + BMI2 / Bit Manipulation instructions
- F16C / 16-bit Floating-Point conversion instructions
- FMA3 / 3-operand Fused Multiply-Add instructions
- EM64T / Extended Memory 64 technology / Intel 64
- NX / XD / Execute disable bit
- HT / Hyper-Threading technology
- VT-x / Virtualization technology
- TBT 2.0 / Turbo Boost technology 2.0
- TXT / Trusted Execution technology
- TSX / Transactional Synchronization Extensions
|
Integrated peripherals / components |
Integrated graphics |
None |
Memory controller |
The number of controllers: 2
Memory channels per controller: 3
Supported memory: DDR4-2400
DIMMs per channel: 2
ECC supported: Yes |
Other peripherals |
- Ultra Path Interconnect (2 links)
- PCI Express 3.0 interface (48 lanes)
- Direct Media Interface 3.0 (4 lanes)
|
Electrical / Thermal parameters |
Maximum operating temperature |
76°C (case temperature)
90°C (Digital Thermal Sensor) |
Thermal Design Power |
85 Watt |