| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family |
Intel Xeon Gold
|
| Model number |
5118
|
| Frequency | 2300 MHz |
| Turbo frequency | 3200 MHz |
| Bus speed | 10.4 GT/s UPI |
| Clock multiplier | 23 |
| Package | 3647-land Flip-Chip Land Grid Array (FC-LGA) |
| Socket | Socket 3647 / P0 / LGA3647-0 |
| Size | 2.99" x 2.22" / 7.6cm x 5.65cm |
| Fan/heatsink | 1U form factor |
| Introduction date | July 11, 2017 |
| Architecture / Microarchitecture | |
| Microarchitecture | Skylake |
| Platform | Purley |
| Processor core | Skylake-SP |
| Core stepping | M0 (SR3GF) |
| Manufacturing process | 0.014 micron |
| Die | HCC type |
| Data width | 64 bit |
| The number of CPU cores | 12 |
| The number of threads | 24 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 12 x 32 KB instruction caches 12 x 32 KB data caches |
| Level 2 cache size | 12 x 1 MB caches |
| Level 3 cache size | 16.5 MB non-inclusive shared cache |
| Physical memory | 768 GB |
| Multiprocessing | Up to 4 processors |
| Features |
|
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 2 Memory channels per controller: 3 Supported memory: DDR4-2400 DIMMs per channel: 2 ECC supported: Yes |
| Other peripherals |
|
| Electrical / Thermal parameters | |
| Maximum operating temperature | 81°C (case temperature) 93°C (Digital Thermal Sensor) |
| Thermal Design Power | 105 Watt |
