General information | |
Type | CPU / Microprocessor |
Market segment | Server |
Family |
Intel Xeon Gold
|
Model number |
6130
|
Frequency | 2100 MHz |
Turbo frequency | 3700 MHz |
Bus speed | 10.4 GT/s UPI |
Clock multiplier | 21 |
Package | 3647-land Flip-Chip Land Grid Array (FC-LGA) |
Socket | Socket 3647 / P0 / LGA3647-0 |
Size | 2.99" x 2.22" / 7.6cm x 5.65cm |
Fan/heatsink | 1U form factor |
Introduction date | July 11, 2017 |
Architecture / Microarchitecture | |
Microarchitecture | Skylake |
Platform | Purley |
Processor core | Skylake-SP |
Core stepping | H0 (SR3B9) |
Manufacturing process | 0.014 micron |
Die | XCC type |
Data width | 64 bit |
The number of CPU cores | 16 |
The number of threads | 32 |
Floating Point Unit | Integrated |
Level 1 cache size | 16 x 32 KB instruction caches 16 x 32 KB data caches |
Level 2 cache size | 16 x 1 MB caches |
Level 3 cache size | 22 MB non-inclusive shared cache |
Physical memory | 768 GB |
Multiprocessing | Up to 4 processors |
Features |
|
Integrated peripherals / components | |
Integrated graphics | None |
Memory controller | The number of controllers: 2 Memory channels per controller: 3 Supported memory: DDR4-2666 DIMMs per channel: 2 ECC supported: Yes |
Other peripherals |
|
Electrical / Thermal parameters | |
Maximum operating temperature | 87°C (case temperature) 96°C (Digital Thermal Sensor) |
Thermal Design Power | 125 Watt |