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Intel Xeon Gold 6130 16C 125W 2.1GHz Processor
General information
Type CPU / Microprocessor
Market segment Server
Family
Intel Xeon Gold
Model number
6130
Frequency 2100 MHz
Turbo frequency 3700 MHz
Bus speed 10.4 GT/s UPI
Clock multiplier 21
Package 3647-land Flip-Chip Land Grid Array (FC-LGA)
Socket Socket 3647 / P0 / LGA3647-0
Size 2.99" x 2.22" / 7.6cm x 5.65cm
Fan/heatsink 1U form factor
Introduction date July 11, 2017
Architecture / Microarchitecture
Microarchitecture Skylake
Platform Purley
Processor core Skylake-SP
Core stepping H0 (SR3B9)
Manufacturing process 0.014 micron
Die XCC type
Data width 64 bit
The number of CPU cores 16
The number of threads 32
Floating Point Unit Integrated
Level 1 cache size 16 x 32 KB instruction caches
16 x 32 KB data caches
Level 2 cache size 16 x 1 MB caches
Level 3 cache size 22 MB non-inclusive shared cache
Physical memory 768 GB
Multiprocessing Up to 4 processors
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • AVX-512 / Advanced Vector Extensions 512
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • TBT 2.0 / Turbo Boost technology 2.0
  • TXT / Trusted Execution technology
  • TSX / Transactional Synchronization Extensions
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 2
Memory channels per controller: 3
Supported memory: DDR4-2666
DIMMs per channel: 2
ECC supported: Yes
Other peripherals
  • Ultra Path Interconnect (3 links)
  • PCI Express 3.0 interface (48 lanes)
  • Direct Media Interface 3.0 (4 lanes)
Electrical / Thermal parameters
Maximum operating temperature 87°C (case temperature)
96°C (Digital Thermal Sensor)
Thermal Design Power 125 Watt

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