| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family |
Intel Xeon Gold
|
| Model number |
6134
|
| Frequency | 3200 MHz |
| Turbo frequency | 3700 MHz |
| Bus speed | 10.4 GT/s UPI |
| Clock multiplier | 32 |
| Package | 3647-land Flip-Chip Land Grid Array (FC-LGA) |
| Socket | Socket 3647 / P0 / LGA3647-0 |
| Size | 2.99" x 2.22" / 7.6cm x 5.65cm |
| Fan/heatsink | 1U form factor |
| Introduction date | July 11, 2017 |
| Architecture / Microarchitecture | |
| Microarchitecture | Skylake |
| Platform | Purley |
| Processor core | Skylake-SP |
| Core stepping | H0 (SR3AR) |
| Manufacturing process | 0.014 micron |
| Die | XCC type |
| Data width | 64 bit |
| The number of CPU cores | 8 |
| The number of threads | 16 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 8 x 32 KB instruction caches 8 x 32 KB data caches |
| Level 2 cache size | 8 x 1 MB caches |
| Level 3 cache size | 24.75 MB non-inclusive shared cache |
| Physical memory | 768 GB |
| Multiprocessing | Up to 4 processors |
| Features |
|
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 2 Memory channels per controller: 3 Supported memory: DDR4-2666 DIMMs per channel: 2 ECC supported: Yes |
| Other peripherals |
|
| Electrical / Thermal parameters | |
| Maximum operating temperature | 79°C (case temperature) 100°C (Digital Thermal Sensor) |
| Thermal Design Power | 130 Watt |
