| General information | |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family |
Intel Xeon Platinum
|
| Model number |
8170
|
| Frequency | 2100 MHz |
| Maximum turbo frequency | 3700 MHz |
| Bus speed | 10.4 GT/s UPI |
| Clock multiplier | 21 |
| Package | 3647-land Flip-Chip Land Grid Array (FC-LGA) |
| Socket | Socket 3647 / P0 / LGA3647-0 |
| Size | 2.99" x 2.22" / 7.6cm x 5.65cm |
| Fan/heatsink | 1U form factor |
| Introduction date | July 11, 2017 |
| Architecture / Microarchitecture | |
| Microarchitecture | Skylake |
| Platform | Purley |
| Processor core | Skylake-SP |
| Core stepping | H0 (QMQC, SR37H) |
| CPUID | 50654 (QMQC) |
| Manufacturing process | 0.014 micron |
| Die | XCC type |
| Data width | 64 bit |
| The number of CPU cores | 26 |
| The number of threads | 52 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 26 x 32 KB 8-way set associative instruction caches 26 x 32 KB 8-way set associative data caches |
| Level 2 cache size | 26 x 1 MB 16-way set associative caches |
| Level 3 cache size | 35.75 MB non-inclusive shared cache |
| Physical memory | 768 GB |
| Multiprocessing | Up to 8 processors |
| Extensions and Technologies |
|
| Low power features | Enhanced SpeedStep technology |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 2 Memory channels per controller: 3 Supported memory: DDR4-2666 DIMMs per channel: 2 ECC supported: Yes |
| Other peripherals |
|
| Electrical / Thermal parameters | |
| Maximum operating temperature | 89°C (case temperature) 99°C (Digital Thermal Sensor) |
| Thermal Design Power | 165 Watt |
