General information | |
Type | CPU / Microprocessor |
Market segment | Server |
Family | Intel Xeon Gold |
Model number |
6330
|
Frequency |
2 GHz / 2000 MHz
|
Maximum turbo frequency |
3.1 GHz / 3100 MHz
|
Bus speed | 11.2 GT/s Ultra Path Interconnect |
Clock multiplier | 20 |
Package | 4189-land Flip-Chip Land Grid Array (FC-LGA) |
Socket | Socket LGA4189-4 |
Size | 3.05" x 2.22" / 7.75cm x 5.65cm |
Introduction date | April 6, 2021 |
Architecture / Microarchitecture | |
Instruction set | x86 |
Microarchitecture | Ice Lake |
Platform | Whitley |
Processor core | Ice Lake-SP |
Core stepping |
D1
D2 |
CPUIDs |
606A6
|
Manufacturing process | 0.010 micron |
Die | XCC type |
Data width |
64 bit
|
The number of CPU cores | 28 |
The number of threads |
56
|
Floating Point Unit | Integrated |
Level 1 cache size | 28 x 32 KB instruction caches 28 x 48 KB data caches |
Level 2 cache size | 28 x 1.25 MB caches |
Level 3 cache size | 42 MB shared cache |
Cache latency | 5 (L1 cache) 14 (L2 cache) |
Physical memory |
6 TB (DDR4 + Optane PMem 200, per socket)
4 TB (DDR4 memory, per socket) |
Multiprocessing | Up to 2 processors |
Extensions & Technologies |
|
Security Features |
|
Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components | |
Integrated graphics | None |
Memory controller |
The number of controllers: 4
Memory channels (per controller): 2Memory channels (total): 8 Supported memory: DDR4-2933 ECC supported: Yes |
Other peripherals |
|
Electrical / Thermal parameters | |
Maximum operating temperature | 86°C (case) |
Thermal Design Power | 205 Watt |